日本語
Processing technologies
Sputtering
Sputtering machine
Example of sputtering
(Copper layer formation on film)
Features
・Thin metal layer is formed with a reel to reel sputtering machine.
・Sputtering of Copper, Ni-Cr alloy and Cr is available.
・Adhesion of sputtered layer is improved by plasma treatment of base material.
Material scale for sputtering
| Roll diameter | max 350mm |
|---|---|
| Weight | max 500kg |
| Material width | max 1,100mm |
| Sputtered width | max 1,000mm |
