フィルム精密加工、プラズマ表面処理のトップメーカー

• 
• 
  • Plasma surface treatment
  • Slitting
  • Film/sheet processing
  • Heat lamination
  • Clean coating
  • Board forming
  • Pure water cleaning
  • Sputtering
• 
  • Slit products
  • Coating products
  • Adhesiveless laminate materials
  • Materials for TAB/COF manufacturing
  • Insulators for motors
  • Insulators for transformers
  • Router processed products
  • Transparent polyimide powder
  • Other products
• 
  • R & D policy
  • Technology development
  • Analysis technics
• 
  • Mission
  • Policy
  • Company profile
  • Locations
  • History
  • Organization
• 

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• Processing technologies
• Plasma surface treatment
• Slitting
• Film/sheet forming
• Heat lamination
• Clean coating
• Board forming
• Pure water cleaning
• Sputtering

• Products
• Slit products
• Coating products
• Adhesiveless laminate materials
• Materials for TAB/COF manufacturing
• Insulators for motors
• Insulators for transformers
• Router processed products
• Transparent polyimide powder
• Other products

• Research and
  　development
• R & D policy
• Technology development
• Analysis technics

• Company
  　information
• Mission
• Policy
• Company profile
• Locations
• History
• Organization